Hi Dan - I went through my files and found a couple of papers that might be
useful:

"The Rough or Grainy Solder Phenomenon", Ronald Bulwith, PC Fab October
1986, pp23-35.

"??? On Surface Mount Components", H. Steen, Circuit World, Vol. 112, No.
1, 1984,
(I lost the first title words due to a poor photocopy)

Most technologist would not want a cold solder joint (per IPC -T-50
definition) on an assembly because in most use environments the reliability
would be terrible.  Good Luck.

Dave Hillman
Rockwell Collins
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