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October 1997

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Subject:
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 1 Oct 1997 12:31:54 -0500
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Hi Dwayne - I suggest you get a copy of the recently held IPC PWB Surface
Finishes and Solderability conference proceedings. There were a number of
presentations that include information, both pro and con, on the use of
immersion gold. The biggest driver for switching to immersion gold from
HASL was not solder joint reliability but the need for a flat pad for fine
pitch onseration. Give Jack Crawford at IPC a call for info on how to get
the proceedings. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]




[log in to unmask] on 10/01/97 07:00:07 AM

Please respond to [log in to unmask]; Please respond to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: David D Hillman/CedarRapids/Collins/Rockwell)
Subject:  [TECHNET] Gold Immersion Plating




I am considering to switch the plating used on our PCB's from HASL to
gold immersion.  The reason I am considering making this change is to
improve the solder joint reliability of our 20mil components.
My company is a manufacture of RF products from 300MHz to 2.4GHz. When I
switch to gold immersion plating is there any electrical characteristics
I should be concerned about between gold immersion and HASL.  Is there
any types of testing I should do to verify I did not change the
performance of my products.
Any information would be helpful.

Thank you for you time.

Dwayne Niewiemski
Director of Manufacturing Engineering
Microwave Data Systems
Rochester, New York
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