We've got a few different RF surface mount components (amplifier,
          mixer ect.)that need to have the bottom surface of the component
          soldered directly to the ground plane of the surface mount board.
          This is necessary for proper electrical performance.  The parts are
          packaged on tape & reel for pick & place assembly.  The component
          leads are pretinned, but the bottom of the components are gold
          plated, approx 50 microinches.

          Two questions:

          1.   Can we get away without removing the gold from the bottom of
               the components?

          2.   What's the best way to pretin the bottom of the component,
               approx .5" square?

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