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October 1997

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Subject:
From:
"Phillip E. Hinton" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 9 Oct 1997 13:26:25 -0400
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Sid

I have had very good performance results with either Ni/Pd/Au or Ni/Pd as far
as solderability and high temperature performance.  These finishes are all
electrolytic and the palladiuim and gold are thin, 6 to 12 microinches thick.
 I have had some problems with the immersion/electroless prodcut in the past
and do not presently specify such.  If you want further information about
supplier chemisty or the finshed product, contact me.

Phil Hinton
[log in to unmask]

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