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October 1997

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Subject:
From:
Afri Singh <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 1 Oct 1997 12:11:11 -0400
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (106 lines)
I have seen a very interesting report done by Irlandus circuits IRELAND
It was done with Coates LPISM using 4 different finishes and a few
different fluxes. They have some interesting graphs that show the
relationship between different fluxes and LPISM
You can get a copy of the report from Irlandus or ASI/ Coates
AFRI Canada

On Mon, 29 Sep 1997, Phil Bavaro wrote:

> We have run some preliminary experiments with this soldermask after running
> the same testing on about six other mask materials.
>
> The results were good enough to convince us to try some real production
> lots with it.  We are right in the middle of this confirmation effort at
> present.
>
> Solderball free was not an accurate description, but the preliminary
> results indicated a 90% reduction compared to next best mask.
>
> We currently use Enthone DSR-3241 which leaves plenty of wavesolderballs
> (although they are very small) behind.
>
> As far as the comment about the relationship between the mask and the
> wavesolderballs, it is only one factor in a complex process, however it is
> a factor which we can control.  Quantity of flux applied to the board and
> the preheating have to also be optimized for the least conducive conditions
> to create solderballs.
>
> I would appreciate hearing any information/comments on this subject as this
> has been a thorn in our sides for a long time now.
>
>
> Phil
> ------
>
>
>
> At 2:40 PM +0300 9/29/97, Johannes Sivula wrote:
> >Hi,
> >You wrote:
> >
> >     Could anyone share any experiences with me about Carapace Electra LPI
> >     which was claimed solder ball free with no-clean?
> >     Please reply to me directly.
> >     As always, look forward to your helpful replies.
> >     Thanks,
> >     Yuan
> >     Exabyte
> >
> >
> >
> >Did you get any replies ? If you get any, please forward them to me.
> >I would appreciate that.
> >By the way, how did you come by the idea that solder balling has something
> >to do  with  solder mask ?
> >I have read that that is  the case, but I have not seen any serious report
> >to back up my idea.
> >Brs,
> >Johannes Sivula,  Reliability Engineer,
> >Tellabs Oy
> >
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>
> Phillip A. Bavaro
> Senior Manufacturing Engineer
> [log in to unmask]
> (619) 658-2542
>
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