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October 1997

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Subject:
From:
David D Sullivan <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 9 Oct 1997 09:11:32 -0500
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Ar

We had this problem with one supplier who finally eliminated it by
icreasing electroplated nickel thickness to >0.0002".  They still had
undercut.  However, the nickel was thick enough and strong enough to hold
together, not break and not sliver.

Regards,

Dave Sullivan
PWB Applications Engineer
Rockwell Collins, Inc.
[log in to unmask]





[log in to unmask] on 10/07/97 11:59:59 AM

Please respond to [log in to unmask]

To:   [log in to unmask]
cc:    (bcc: David D Sullivan/CedarRapids/Collins/Rockwell)
Subject:  [TECHNET] Gold Slivers




Does anyone know of a way to completely eliminate gold slivers on a PWB
which is manufactured using a selective gold process? We realize due to
the etch factor, that there will be a 1.4 mil outgrowth when etching 1
oz. copper cladded material.
Mil-P-55110 recognizes that outgrowth will be present on conductors
plated with metals other than solder, but our customer cannot tolerate
slivering.  We've tried brushing them off with a brass wire brush, but
this seems to aggravate the problem.
Any input would be greatly appreciated.
Thank you
Art
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