Charles Barker@IO-US
10/15/97 04:59 PM
American Pacific Associates
304 Dunwoody Chace NE
Atlanta, GA 30328-4587
770-804-0044
770-391-9590
770-391-9593 FAX
Mr. Ted Bova
These folks handle the RP system to protect against oxidation of electronic
parts. I have not used this product. I only happen to have asked for info
from them and still have it in my files.
Good luck.
Please respond to [log in to unmask]; Please respond to [log in to unmask]
To: [log in to unmask]
cc: (bcc: Charles Barker/IO-US)
Subject: [TECHNET] ASSY -OSP-Preserving Solderability
Hello!
I am looking for a good method for storing OSP PC assemblies that have
been
subjected to one selective solder reflow. The concern is with the
solderability of remaining OSP coated surfaces. Obviously we need to do
testing of different storage conditions. The requirement is to store
these
assemblies for 12 weeks or more. Has anyone experience with preserving
solderability of OSP boards after thermal cycles?
As an example, will an oxidation arrest paper work?
It is a good alternative to a nitrogen atmosphere when storing bare
copper.
Can anyone tell me where to obtain oxidation arrest paper?
Thanks
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################