I am currently designing a PCB consisting of 30 different BGA devices.  I've
read the IPC-SM-782 3.6.1.8&9, but it describes nothing about fiducials with
BGA devices.  In addition, the IPC spec. states that a minimum of 2 local
fiducials are required WITHIN the perimiter of the land pattern.  This makes
sense when viewing figure 3-15, but what about BGA's & TSOP type devices?
Figure 3-15 also states that the fiducials should be placed on the
appropriate grid.  I assume that the appropriate grid would be a multiple of
the pad pitch of the component?  If any one has any experience or
documentation pertaining to these issues, I would appreciate your input.

Thanks.

Dave.
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