Subject: | |
From: | |
Reply To: | TechNet Mail Forum. |
Date: | Wed, 1 Oct 1997 08:26:49 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Dwayne:
Switching to gold will help with your fine pitch placement. Vision is
much better for pick & place. Some things to consider if you have any
mixed technology. Retrain your operators to recognize what a good
solder joint looks like with immersion gold. This was probably one of
our biggest issues. Operators in our MIL environment were used to
HASL and didn't understand what a good solder joint on gold was
suppose to look like. If the pad was not completely covered with
solder it was rejected. If the fillet is good, but does not cover the
whole pad, is not grounds for rejection. The other thing to consider
is material handling. Finger prints will not help (obvious).
With solder paste the gold will desolve into the solder joint for each
solder connection so it would be good to watch for gold embrittlement.
You may need to specify your gold thickness.
Hope this helps a little.
Ron H.
[log in to unmask]
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################
|
|
|