>I have a problem of cracking in 1206 ceramic components during
>wavesoldering.  I have investigated the thermal shock issue, and wonder if
>there are any other likely causes.

Since you have eliminated lot code and vendor as potential causes, have you looked
back upstream at your SMT pick and place machines?  A long time ago, when using
machines that had mechanical centering jaws, we saw cracked parts from the jaws
"slapping" into the parts.  The cracks were barely visible after placement and adhesive
curing, but were noticed after wave solder.  With careful (and constant) adjustment of
the centering jaw mechanism, we eliminated the cracked parts.  Just one more
reason I'm a fan of vision systems on SMT machines!

Hal Winslow
Sr Mfg Engineer
SCI Systems
(603) 628-4862 ph

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################