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From: | |
Reply To: | TechNet Mail Forum. |
Date: | Thu, 23 Oct 1997 12:07:00 CDT |
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I have read IPC-4202 - Assembly Process Preconditioning for Qualification of
Components, and have a few questions about wave solder profiling. I was
hoping that someone may provide some insight.
Specification Questions
1. Should wave solder profiling be done with a soldered board or
unsoldered board?
2. In selection of the location of the thermal couples, should any
consideration be given to the hot/cold locations on the
board?
3. What is the optimal solder pot temperature?
I can be reached at :
Kirk Van Dreel
585 Enterprise Drive
P.O. Box 529
Neenah, WI 54957
Phone: (920)720-6651
Fax: (920)720-6702
Email: [log in to unmask]
Thanks,
Kirk
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