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Reply To: | TechNet Mail Forum. |
Date: | Wed, 22 Oct 1997 11:35:17 +0200 |
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Fellow Technetters,
At present we use a screenable laquer from Lackwerke Peters
(Werner Peters SD 2955) to cover inboard Ni/Au (hardgold)
contacts/connectors during horizontal hot air levelling.
In a few months however we are not allowed to use the fluid to strip
this laquer anymore, due to enviromental reasons.
We have tried peelable solderresists but these are not 100 %
resistant to the pressure during horizontal hot air levelling resulting
in P/Sn particles on the Ni/Au contacts.
Manual taping is also no option volumewise.
# Which materials/processes are available for manufacturers which
use horizintal HASL to cover, in medium/high volume, inboard
Ni/Au contacts before HASL?
Any thoughts on the subject or any other alternatives would be
appreciated.
Thanks,
Rob van Pol
MOMMERS PRINT SERVICE B.V.
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