Subject: | |
From: | |
Reply To: | TechNet Mail Forum. |
Date: | Fri, 17 Oct 1997 07:24:33 +0000 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hello Net members
I tried this quistion at the specific IPC-SM-840 Forum, but only got one reply. Hope TechNet are more "alive" on this issue !!
We are right now going though the c revision of the standard, and have found some "muddy" places in the tekst.
Does someone have some sort of a official or unofficial list of know errors in the IPC.SM-840 standard ??? And perhaps a posibly correction !?
If so.... I would just loooove to have a copy !!
Thanks in advance !!
Here are some of mine own findings :
ex: 3.9.3 Thermal shock.
The text calls out for soldering speciments before testing, but table 10 only suggest a sample tested before soldering. !!??
and this:
3.9.2 Electrochemical Migration
Table 5 specifies class T conditions 85*C/85%Rh while IPC-TM 650 test method 2.6.14 (rev B) in paragraph 5.1 specifies class T conditions 85*C/90%Rh
And there is properbly more of the same stuff, if I keep looking !!
Lars L Holm.
Quality Engineering
Printca AS. Denmark.
Email: [log in to unmask]
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################
|
|
|