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Reply To: | TechNet Mail Forum. |
Date: | Thu, 16 Oct 1997 23:31:34 -0400 |
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Hi Rich,
What you are asking for has been done in IPC-TR-484, "Round Robin Reliability
Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards."
An update of the formulas used can be found in Appendix B of IPC-D-279,
"Design Guidelines for Reliable Surface Mount Technology Printed Board
Assemblies". For even more information, you could attend my workshop
"Design, Manufacturing and Reliability Issues of
Small-Diameter/High-Aspect-Ratio Plated-Through-Holes and Vias".
Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ 07945 USA
Phone & Fax: 973-543-2747
E-mail: [log in to unmask]
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