Hello!
I am looking for a good method for storing OSP PC assemblies that have been
subjected to one selective solder reflow. The concern is with the
solderability of remaining OSP coated surfaces. Obviously we need to do
testing of different storage conditions. The requirement is to store these
assemblies for 12 weeks or more. Has anyone experience with preserving
solderability of OSP boards after thermal cycles?
As an example, will an oxidation arrest paper work?
It is a good alternative to a nitrogen atmosphere when storing bare copper.
Can anyone tell me where to obtain oxidation arrest paper?
Thanks
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