Gus Morvillo wrote:-
>I am looking into E Ni/ I Au surface finishes, and have heard of a concern
>about press fit connectors and barrel cracking. Has anyone experienced this
>problem?
>Would there be a retention force issue, with one removal and re-insert?
Hi Gus,

E Ni/I Au is not recommended for press fit for two reasons.
Firstly, solder acts as a lubricant to pin insertion and forms a gas
tight seal which is why it is recommended for press fit.
Secondly, Electroless Nickel is brittle and fractures which could result
in stray metal causing subsequent connector shorts. Also, there is no
gas tight seal formed which could lead to future corrosion.

We produce many multi-layer backplane pcb's for global companies and
they still specify tin-lead, either Reflowed or HASL. I have not seen
any other alternatives mentioned or been asked to come up with one.

Best Regards
Paul Gould
[log in to unmask]
Teknacron Circuits Ltd
Isle of Wight,UK

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