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October 1997

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roberto tulman <[log in to unmask]>
Date:
Sat, 4 Oct 1997 14:06:50 +0200
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"TechNet Mail Forum." <[log in to unmask]>, roberto tulman <[log in to unmask]>
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HI
To the best of my understanding your customer should pre-bake
the coupons prior to thermal stress. As well as pre baking prior to assy.
We do not monitor hole pullaway on double sided, only in ML boards, and almost
don't have this phenomena.
Plasma gives a too smooth surface, and the best is the chemical permanganate.
hope this helps
Roberto


At 08:19 AM 3/10/97 -0400, you wrote:
>Note: We have a customer who performs a thermal stress on unconditioned (no
>pre-bake) coupons and then checks for the % of hole wall pullaway.
>
>1. Do any PWB manufacturers monitor the frequency and % of hole pullaway on
>double sided vs multilayer boards.
>2. What is an average frequency and %?
>3. What is the opinion on the best hole wall prep? Chemical, plasma or a
>combination of both?
>
>Thanks for any input and advice,
>Scott
>
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Roberto Tulman
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