TECHNET Archives

October 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
X-To:
chiman chan <[log in to unmask]>
Date:
Wed, 1 Oct 1997 23:41:53 -0700
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, David P Ho <[log in to unmask]>
Subject:
Re: Solder resist blisters
MIME-Version:
1.0
Content-Transfer-Encoding:
7bit
Content-Type:
text/plain; charset="us-ascii"
From:
David P Ho <[log in to unmask]>
Parts/Attachments:
text/plain (10 lines) 
 We had a simular problem in the past, the small vias that get covered with
Lpi resist will pop during final bake or at HAL.  We've gone to a different
brand of resist and this problem is eliminated.  ( The current resist is a
nova epoxy based material)

-----Original Message-----
From: chiman chan <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>

ATOM RSS1 RSS2