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September 1997

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SMTPGATE <[log in to unmask]>
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Date:
Thu, 4 Sep 1997 09:18:58 -0400
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Mail*Link¨ SMTP               [TECHNET] FAB: Acceptabilty of dents

Fellow Tech-Netters:

Some of the high-volume single-sided boards we produce are punched. At times
we find repetitive dents on the surface of each board where a laminate chip
has lodged on the face of the die, causing a slight depression with each hit
until it is cleared away. These dents are typically no more than .050" in
diameter and do not cut foil or reduce cross section, just depress it a bit
into the base laminate (1/0 .062" CEM-1 or FR-4). Is anyone aware of an IPC
spec or other reason why these class 1 and 2 boards should be rejected?
In the absence of these, personal opinions on acceptability would also be
appreciated.

Bill Parlin


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