TECHNET Archives

September 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Reply To:
TechNet Mail Forum.
Date:
Tue, 30 Sep 1997 16:46:17 PST8
Content-Type:
text/plain
Parts/Attachments:
text/plain (17 lines)
     Yuan ,
      No solder ball problem here . We do have problems with coverage on
     the substrate in areas between high density flat pac's .



     Mike
     MCCovel@CCgate .HAC.COM




______________________________ Reply Separator _________________________________
Subject: [TECHNET] solder-ball free LPISM?
Author:  "TechNet Mail Forum." <[log in to unmask]>, [log in to unmask] at CCGATE


ATOM RSS1 RSS2