Hi Steve, Poh, et al!

The topic of placement accuracy is ironic - I will be presenting a paper on
our just completed placement capability effort at the IPC meeting in
Arlington next week on Wednesday afternoon in the S12 session. I don't
really talk about the data in true numbers but from a methodology
standpoint I do. We followed a two step pattern: (1) conduct a sticky tape
test to understand the equipment aspects of gauge R&R for onsertion
process; (2) conduct a solder paste test to understand the process
interaction aspects of gauge R&R on the onsertion process. If you only do
#1 then you miss an important part of the test - the interaction of the
component leads being pushed on/into the solderpaste plus any reflow
characteristics. If you only do #2 then you miss out on the equipment
contribution to the gauge R&R measurement.  Good Luck.

Dave Hillman
Rockwell Collins
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