TECHNET Archives

September 1997

TechNet@IPC.ORG

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Subject:
From:
Brian Moe <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 29 Sep 1997 10:04:57 -0700
Content-Type:
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     We do not experience any problems with solderballs in our
     manufacturing process.  We are using LeaRinol or Probamere
     soldermasks.

     Our wave solder machine is using RMA type flux applied by a spray
     fluxer.  With the addition of a hot gas knife at the end of our
     process solderballs and bridging defects have practically been
     eliminated.




______________________________ Reply Separator _________________________________
Subject: Re: [TECHNET] solder-ball free LPISM?
Author:  Phil Bavaro <[log in to unmask]> at ccgate


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