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September 1997

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Subject:
From:
Phil Bavaro <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 29 Sep 1997 09:39:34 -0700
Content-Type:
text/plain
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text/plain (85 lines)
We have run some preliminary experiments with this soldermask after running
the same testing on about six other mask materials.

The results were good enough to convince us to try some real production
lots with it.  We are right in the middle of this confirmation effort at
present.

Solderball free was not an accurate description, but the preliminary
results indicated a 90% reduction compared to next best mask.

We currently use Enthone DSR-3241 which leaves plenty of wavesolderballs
(although they are very small) behind.

As far as the comment about the relationship between the mask and the
wavesolderballs, it is only one factor in a complex process, however it is
a factor which we can control.  Quantity of flux applied to the board and
the preheating have to also be optimized for the least conducive conditions
to create solderballs.

I would appreciate hearing any information/comments on this subject as this
has been a thorn in our sides for a long time now.


Phil
------



At 2:40 PM +0300 9/29/97, Johannes Sivula wrote:
>Hi,
>You wrote:
>
>     Could anyone share any experiences with me about Carapace Electra LPI
>     which was claimed solder ball free with no-clean?
>     Please reply to me directly.
>     As always, look forward to your helpful replies.
>     Thanks,
>     Yuan
>     Exabyte
>
>
>
>Did you get any replies ? If you get any, please forward them to me.
>I would appreciate that.
>By the way, how did you come by the idea that solder balling has something
>to do  with  solder mask ?
>I have read that that is  the case, but I have not seen any serious report
>to back up my idea.
>Brs,
>Johannes Sivula,  Reliability Engineer,
>Tellabs Oy
>
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Phillip A. Bavaro
Senior Manufacturing Engineer
[log in to unmask]
(619) 658-2542

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