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September 1997

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Subject:
From:
"Dhawan, Ashok" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Sat, 27 Sep 1997 13:09:03 -0000
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multipart/mixed
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Warren,
you may try wafer fabrication units--Mitel Corporation.Most of fabs have
plenty of rejected wafer . Mitel is in Quebec . I do not have contact
no.
There are no. of fabs in States.Even you may try the manuf of
device/chip --eg. Xylinix, Rockwell,ASM , intel etc.

> ----------
> From:         Warren
> Szkolnicki[SMTP:[log in to unmask]]
> Sent:         September 26, 1997 12:00 PM
> To:   [log in to unmask]
> Subject:      [TECHNET] ASSY: Source for "Dummy" Bare Die
>
>
> Does anyone have a source for dummy bare die for use in die bonding /
> wire bonding process setup?
> My preference is for gold metalized die for gold wire bonding.
>
> At this point, I do not need anything as sophisticated as the Sandia
> ATC
> series die.
>
> I have been talking to the people who supply the wire bonding
> equipment,
> but I am also looking for other known sources.
>
> And before anyone says it, Topline does not supply bare die.
>
> Regards
>
> Warren Szkolnicki
> Process Engineer
> Broadband Networks Inc.,
> 37 Stevenson Road,
> Winnipeg, MB, CANADA  R3H 0H9
>
> email:  [log in to unmask]
> ph: (204) 982-8480 x 229
> fax: (204) 982-8487
> WWW: http://www.broadbandnetworks.com
>
>


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