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September 1997

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Subject:
From:
"Dhawan, Ashok" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Sat, 27 Sep 1997 12:28:49 -0000
Content-Type:
text/plain
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text/plain (79 lines)
lang,
we are also in similar situation and like to have info on these .
So, technetts--shower info on this topic . We need your help.

thanks in advance to all who will respond.
> ----------
> From:         Lang, Michael[SMTP:[log in to unmask]]
> Sent:         September 26, 1997 12:29 PM
> To:   [log in to unmask]
> Subject:      [TECHNET] microBGA's and CSP's
>
> Has anyone out there done any work with microBGA's?  Specifically, I
> am
> looking for information or discussions on:
>
>
> 1) Stencil sizes and apertures.
>
>
> 2) Microvias...  The good, the bad, and the ugly
>
>
> 3) Routing out on the PCB...  What are the limitations
>
>
> 4) PCB design for uBGAs...  The laminates, thicknesses, technology
> (deposition or etch), pad design, etc.
>
>
> 5) Co-mingling uBGA's with 0.050" or 0.025" parts...
>
>
> 6) To clean, or not to clean...
>
>
> 7) X-ray requirements
>
>
>
> I wish to start an evaluation on these parts and would like to find a
> good
> starting point...
>
>
> Thanks,
>
> Michael Lang
> ITT Avionics
> [log in to unmask]
> (201) 284-2917
>
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