My first question is what specification were the bare
boards certified to meet?

If military or ipc, class 3, there are certain expectations
1)  they should have no separation after 10 sec float on
     solder at 550F
2)  they should have no separation after rework simulation
     testing (5 solder melt cycles to simulate initial insertion,
     removal, reinsertion, removal and final insertion)

These tests are believed to identify problems with quality
of bonding between all plating interfaces.  So it is important
to know if the lot your boards came from were tested and
found to pass.

The problem is that the soldering process that was used
to solder the wires could be at fault.  So you would also
have to investigate to insure the boards were no over stressed
in soldering or desoldering the wires.

If you find that the boards were the problem, then the plating
process, desmear and possibly drilling people would have to
 address the potential causes.

Susan Mansilla
Robisan Laboratory

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