We seem to have a minor problem when working on select components.

Boards are 8-layer GIL 2 planes at layers 2 and 7.  We solder in test leads
to the select component locations determine the select value required
through testing,  remove the test leads and install the selected device.

Periodically we have had opens after soldering the device in place and have
determined that it is always at a signal interface on an inner layer.  That
is to say not where there is a thermal pad on a plane.  We attribute this to
the soldering process, dwell, temp.,etc.  What I'm concerned with is the
mechanism.  After x-sectioning the areas in question, it appears as though
the barrel copper has separated from the layer.  IE electroless copper bond
is weak or some other cause.

What experience have you had and what did you do to fix it?

"Thanks for your support" (B&J)

Richard MacCutcheon
BFGoodrich Aerospace
Data Systems Div.

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