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September 1997

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Subject:
From:
Jim Marsico 516-595-5879 <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 26 Sep 1997 08:53:00 -0400
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (38 lines)
We are presently using an Air-Vac system with good results.  During my
equipment evaluation, Air-Vac was able to remove a 1089 ceramic BGA,
approximately 1.75" square, from a board which was bonded to a 1/8"
silicon-carbide aluminum core without effecting surrounding components or
components on the other side.  Point is, heat wasn't a problem (it did take
some time, though).  The vision system and lighting works well, although white
ceramic components have little contrast with the solder balls, making the
alignment for these type devices more difficult. (fortunately, all of our BGAs
use the brown ceramic packages)

Feel free to call me if you'd like to discuss this further.

Jim Marsico
(516) 595-5879
[log in to unmask]

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