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September 1997

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Subject:
From:
Graham Naisbitt <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 25 Sep 1997 23:32:32 UT
Content-Type:
text/plain
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John, I will send you some information about recent developments we have made
into reliability testing.

I expect to be in Ireland in the near future and will call you

Graham Naisbitt


Concoat Ltd                                     Email: [log in to unmask]
Alasan House, Albany Park                       Tel:    +44 (0)1276 691100
Camberley, Surrey GU15 2PL UK           Fax:    +44 (0)1276 691227


-----Original Message-----
From:   TechNet  On Behalf Of John Lohan *
Sent:   Tuesday, September 23, 1997 3:29 PM
To:     [log in to unmask]
Subject:        [TECHNET] Case Studies on Implementing ESS

Hi Everybody,

Let me first give a brief introduction.  Working with a University based
research group, it is part of my brief to undertake technology reviews
from time-to-time.  This effort is then supported by research activity
which in turn helps support Irish Industry.

My interest in electronic component heat transfer and in predicting
operating junction temperatures over the last six years has now lead me
closer to the area of electronic component/system reliability.  In
particular, we have identified a need to gain a better understanding for
the different environments used to expose latent manufacturing defects
within electronic systems during either the Burn-in or
Thermal/Environmental Stress Screening (ESS) Process.  These include
high temperature burn-in, temperature cycling, power-cycling, combined
power-on and temperature cycling, humidity testing, vibration testing
and even altitude testing.

While I have already accumulated many publications that describe the
impact of specific component packaging and interconnection issues on
Component Reliability, I find it difficult to trace recent Case Studies
that describe the implementation of a burn-in or ESS programme.  I would
hope that such case studies might relate the type of failures exposed to
the Environmental Test Conditions imposed, through to the type of
Product under test .  Understandably, the implementation process is an
iterative one, with the continuous desire for high performance stress
screens that cost less to implement and have shorter run times.

Therefore, I would greatly appreciate any helpwith this enquiry; whether
it be contact names, relevant publications or case studies.

Thanking you in advance,

John Lohan.

====================================================
Dr. John Lohan
Research Officer
PEI Technologies
Thermal Management Research Centre
University of Limerick
Ireland.

Tel: +353-61-202449
Fax: +353-61-202393
Email: [log in to unmask]
====================================================

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