Hi, Dhawan
I don't think the alignment is correlative to the glueing process,
better check the pick and place machine! To determine whether is
placement issue, you can inspect the stuffed boards prior to curing. If
they are already misaligned, that basically is the place machine
problem. Otherwise, you can do some study on the glue process, check
your curing profile as well.
If you really want to go for combination process of screen printing and
epoxy dispensing, couple critical factors need to be concerned, aperture
opening and thickness of stencil.
This process is very normal, but it is not for the application you are
looking for.  I hope my commnent is a little bit help to you!

Fulton Feng


>----------
>From:  Dhawan, Ashok[SMTP:[log in to unmask]]
>Sent:  Thursday, September 25, 1997 6:19 AM
>To:    [log in to unmask]
>Subject:       [TECHNET] 0603 chips -- alignment problem
>
>I am gluing 0603 components and had alignment problems . For dense
>boards, it is apinful to check and realign.
>Recently, I thought of using solder paste print to work for alignment of
>parts-glue is still dispensed to hold components for wave.
>
>Any body using such a process?
>
>I would like to share experience on this process.
>
>[log in to unmask]
>
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