Make sure you are using the EPA version prior to dipping-solvent
     consumption goes up dramatically.

     In a previous job, I have compared the same panel both dipped and
     sprayed with a silicone. The initial failure mode during thermal
     cycling has always been above the dip line where the i/o lines for the
     most sensitive circuit were near the connector. Masking this area for
     dip (opposite connectors) would be prohibitively expensive.

     Dipping also poses severe design restrictions for the customer. All
     connectors, switches, contacts... should be above the dip line, or
     they must be masked using more expensive processes than spray (which
     costs more to mask than a Nordson).

     Collect data of this type (dip in a bucket, if needed) and prove to the
     customer that your product is acceptable without this requirement and it
     should go away.

        Aric Parr

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Subject: [TECHNET] ASSY: Conformal Coating Coverage
Author:  "Devitt; Ken" <[log in to unmask]> at INTERNET