Dear Technetters,

It is known that numerous factors affect the dimensional stability of the
laminates. Not Withstanding this, the test method per IPC-TM-650, 2.4.39, is
still being used to quantify the dimensional stability of laminates.
Furthermore, the results are often being used to reflect the performance of
the laminates in corresponding PCB's.

So, is there an alternate test procedure for dimensional stability that
would give more meaningful data for both the laminator and the fabricator ?

Thanks

Ranjith

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