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September 1997

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Subject:
ASSY: Staking components
From:
Sheila Smith <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 22 Sep 1997 14:59:58 -0400
Content-Type:
text/plain
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text/plain (18 lines) 
Hi!  Does anyone have any experience with using epoxy to encapsulate
components, including the leads, soldered in PTHs?  The entire assembly is
subsequently potted with a thermally conductive silicone.  The goal is to
keep the solder joint from moving during temperature cycling.  Any
suggestions would be appreciated!  Thanks, Sheila Smith @ Tracor AES

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