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September 1997

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Subject:
Re: (TechNet): Assy: Dewetting
From:
Tezak Tim <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 3 Sep 1997 09:05:00 -0400
Content-Type:
text/plain
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text/plain (17 lines) 
Hello Werner Engelmaier,

Although I couldn't recall the "exact" chemistry of the intermetallic
phases or which layers are near the copper or near the solder, I gave
Poh Kong Hui process recommendations which are proven to reduce
dewetting.
Thats what this forum is for.  I appriciate the constructive criticism.

Now, what are your recommendations for Poh Kong Hui request for advise?

(the original request to the TECHNET from Poh)

From: Poh Kong Hui
To: [log in to unmask]
Subject: [TECHNET] (TechNet): Assy: Dewetting

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