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September 1997

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Subject:
From:
Mike Masters <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 19 Sep 1997 13:09:32 -0400
Content-Type:
text/plain
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text/plain (26 lines)
In response to the question of location:

Solder balls are located on the side of the chip cap near either terminal land.
 The solder process is reflow only.  Somponents on both sides exhibit the same
problem.  Other components such as DRAM has no solder balls.

mike


QA Materials Engineering Section
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