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September 1997

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Subject:
Re: Solder Ball criteria
From:
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TechNet Mail Forum.
Date:
Fri, 19 Sep 1997 12:41:36 -0500
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        ONE METHOD WE USE IS TO REDUCE THE APERTURE IN THE PASTE MASK EITHER 20% OR WITH AN APERTURE IN THE SHAPE OF A HOMEBASE POINTING AT EACH OTHER _      _
LIKE THIS----->                                                                          |_ > <_ |

----------
From:   MIME :[log in to unmask]
Sent:   Friday, September 19, 1997 1:29 PM
To:     [log in to unmask]
Subject:        [TECHNET] Solder Ball criteria

<<File: ENVELOPE.TXT>>
Hi All,

I've been looking for ways to eliminate solder balls on SMT chip caps.  I see
a
specification in IPC 610B but would like to know what others have found to
reduce or eliminate solder balls on SMT assemblies especially on chip
capacitors.

Thanks,

Mike
--

QA Materials Engineering Section
Office: (919) 479-3771
FAX:    (919) 479-3328
Internet:  [log in to unmask]

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