Dearest TechNetters,

Can anyone provide a reasonable design guideline for buried and blind vias?
We need advice applicable for the designing OEM to use. These are of the
sequentially laminated and/or controlled depth carbide drilled variety (not
plasma, laser, or photo-formed microvias). We would want it to cover as much
of the following as possible but will take any or all degrees of input if
anyone can help:

1. Varieties of each and when or how to select technology.
2. Guides as to the physical layout requirements, pad sizes, hole sizes,
limitations, good yield practices, known potholes to avoid.
3. Any DFM considerations.
4. Common sense approaches with regard to cost vs. benfefits.
5. Anything important to know that isn't already listed above!

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