TECHNET Archives

September 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Eddie Brunker <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 19 Sep 1997 16:53:03 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines)
My query relates to Compact PCI standard for industrial computers.

Compact PCI specifies connectors which conform to IEC 1076-4-101. This
specifies a press fit connector.
Compact PCI spec. quotes as follows:-
"Connections between voltage planes and connector pins should be a solid (no
thermal relief) interconnect. This provides a low inductance connection
between the connector pin and each power plane."
My question is, does press fit effectively reduce the inductance of a joint
over Surface Mount or Plated Through Hole?

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################


ATOM RSS1 RSS2