Address,

     Assuming you have three (3) oxides present Cuprous Oxide, Cupric Oxide
     and Cuprous Sulfide, how thick is to thick when using the following
     fluxes?

     1. OA              -
     2. RMA             -
     3. No-Clean        -

     When is it determined that the oxide is so thick that standard dwell
     times in process can not remove the oxides regardless?

     i.e., If I have a thickness of 96A of Cupric Oxide while using an OA
     solderpaste at Conveection Reflow, how much could I expect to be
     removed and will all of it be removed?

     Has anyone determined the limits or ratios of flux activity to oxide
     thicknesses?

     Lets also assume that there are no intermettalics effecting the
     solderability since no known fluxs can penetrate the IMC.

     Thank you.

     John Gulley

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################