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September 1997

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Subject:
Solderability of Immersion Gold PCB's
From:
"Crowhurst, Dave" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 18 Sep 1997 09:49:25 -0600
Content-Type:
multipart/mixed
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We are using Kester R 244 62 36 2 solder paste in a double sided
process. Reflow is with forced air and IR in pre heat 1 and the REFLOW
zone, bottom side only (ETC 4 zone oven). The PCB's are manufactured
with the immersion gold process. I am experiencing frosty looking
solder joints. We have attributed this to the gold and silver
contaminants in the solder fillet. This has not effected the
performance of the PCB. Any suggestions or comments.
Thank You

Regards,
[[ MAPI 1.0 storage : 3868 in WINMAIL.DAT ]]

Dave Crowhurst
S.M.T. Process Support
Manufacturing Engineering
Harris Canada Inc.
Wireless Access Div.
Phone (403) 295-5026
Fax      (403) 295-8862

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