K.V.Raj,

It is dependent on all of these to say nothing of the number of layers
required because of board density. Also, you need to keep in mind
that ideally the board should be made of what I call "a balanced
sandwich construction" -to keep it from warping in fabrication and
assembly. Copper should be evenly distributed within the board stack-up
and layout. There are still, other considerations too- outer layer ground
planes to suppress EMI if required, etc., you touched upon quite a few
though. It sounds like you could use a copy of IPC-D-275.

Good Luck,
John Swinehart
BFGoodrich Avionics Systems, Inc.

>>> "Varadaraj.K" <[log in to unmask]> writes:
Hello Technetters

What is the correct procedure to choose Plane layers in a given MLB?.

Is is dependent on Layer construction of a given Fabricator? OR
Is it dependent on Impedanc MAtching? OR
Is it the Capacitive decoupling effect between the power/gnd planes? OR
are there some more considerations to this choice?.

I would like to more know more about this.

thanks in advance

k.v.raj

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