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September 1997

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Subject:
Pad Lifting
From:
Stephen C Joy <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 17 Sep 1997 09:54:00 PDT
Content-Type:
text/plain
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text/plain (17 lines) 
We have seen a low level of pad lifting on 26X26 BGAs with .020 pads on .050"
spacing. The pads always pull polymer with them, so it does not seem to be a
copper adhesion issue.
Any ideas?

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