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September 1997

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Subject:
From:
Orna and Yehuda <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 19 Sep 1997 00:19:46 +0200
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Hi Everyone,
I'm resending this document, hoping that someone out there will have any more input.

Yehuda

  
-----Original Message-----
From:   Orna and Yehuda [FAX:+972 (03) 5274291]
Sent:   Mon, September 01, 1997 12:15 AM
To:     'IPC TechNet'
Subject:        FAB: Reliability tests through ageing

Hi Technetters,
I am trying to introduce a new method for innerlayer preparation into  the manufacturing process. 
I am quite capable of determining the PCB's reliabilty through thermal shocks (solder float, HASL, reflow) and even through quantitative tests such as peel and shear test. 
But can you suggest me tests that can assure me that the boards will "live" for 15-20 years? 

Are there any standard methods for this kind of "ageing" that can present a correlation between the short-run test parameters and the long range life cycle of the product?

Any input will be appreciated.

Thanks and have a nice week,
Yehuda

    ************************************* 
    *          Yehuda E. Weisz              
    *  e-mail: [log in to unmask]
    *  Tel: 972-3-5240362                    
    ************************************

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