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Reply To: | TechNet Mail Forum. |
Date: | Wed, 17 Sep 1997 18:02:20 +0300 |
Content-Type: | text/plain |
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Hi Yehuda !
I tried to call You , but there is something wrong with Your telephones .
As I followed responses on Your questions , You have no real answer .
But I would like to ask You something different :
We are making tests on another blach oxide chemistry . Do you have
possibility to perform peel and shear tests in Your place ?
I would like to talk with You about it . Pls call me to Eltek , or at
evening at home : 03-9646570
Regards .
Edward
At 00:14 01/09/97 +0300, you wrote:
>Hi Technetters,
>I am trying to introduce a new method for innerlayer preparation into the
manufacturing process.
>I am quite capable of determining the PCB's reliabilty through thermal
shocks (solder float, HASL, reflow) and even through quantitative tests such
as peel and shear test.
>But can you suggest me tests that can assure me that the boards will "live"
for 15-20 years?
>
>Are there any standard methods for this kind of "ageing" that can present a
correlation between the short-run test parameters and the long range life
cycle of the product?
>
>Any input will be appreciated.
>
>Thanks and have a nice week,
>Yehuda
>
> *************************************
> * Yehuda E. Weisz
> * e-mail: [log in to unmask]
> * Tel: 972-3-5240362
> ************************************
>
>
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