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September 1997

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From:
"Gomez, Rudy (MS Mail)" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 17 Sep 1997 06:41:00 -0700
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Mark,
First off allow me to thank you for responding to my question!
The populated glass epoxy boards are hand soldered.  The measling occurs
during rework, for the most part.  A few boards have already been
rejected for this condition.   I'm trying to come up with a
recommendation to our subcontractor for prevention of this problem
including inert environment storage after baking.  I'm leaning toward
the 100 deg C for 6 hours schedule you mention in your response, since
it makes sense to take it to the boiling point of water.  My only
concern is oxidation of the solder joints.  Has anyone out there any
experiance with this?
Are there any documented references ie. IPC documents, MIL-STD's, which
cite criteria for this problem?
 ----------
From: Mark W. Spitnale
To: [log in to unmask]
Subject: Re: [TECHNET] (TECHNET) Populated PWB's


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