Wendell, hello

The 4000 series is an hydrocarbon (ceramic/glass) and should work as the
FR-4 or polyimide materials.
I did work with this material without any problems.
The plasma etch isn't really necessary in a double sided, and can prepare a
too smooth surface. A std. permanganate will be just enough (and better). If
you still want to use your plasma you may do that and then use the
permanganate desmear process.
I would not plate the gold without a nickel barrier, but that is another story.
please feel free to write directly if you want to ask anything else.
Roberto ([log in to unmask])

At 10:18 AM 15/9/97 -0500, you wrote:
>In a small pcb shop, our process is a Plasma etch, Shadow (graphite),
>followed by copper plating, then gold pattern plating over copper (no
>nickel) and then etch.  Processes work well for all teflon type matls except
>4003 which is ceramic filled.  Large voids in pth is biggest problem (but
>only in some batches).  If anyone has a process that works well and would be
>willing to share it, or comments on these processes, I would appreciate the
>assistance.  Please reply direct.
>
*****************************************************************************
Roberto Tulman
e-mail: [log in to unmask]
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