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September 1997

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Subject:
Theremal Resistance test on coverlay
From:
"CSS Asia Co., Ltd." <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 2 Sep 1997 20:42:12 +0900
Content-Type:
text/plain
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text/plain (21 lines) 
Hi Technetters.

One of the largest flexible PCB shop in Korea tried to laminate PI coverlay
of one mil thick  onto one mil/one ounce RA PI flexibles and floated  them
on a solder pot at 300 degree C for ten second.  All the test coupons
blistered.  They claimed that Japanese coverlay withstands such condition,
and asked us to improve the thermal resistance of the coverlay.    I would
like to be advised of your opinion on the test and its validity in real
field.  In other word,  what do you see out of the 300 C test?   Could you
give me some light to lead persuade them into 288 C test ?

Thanks and regards

Myung C. Chu

CSS Asia Co., Ltd.
Tel: 82-2-523-8810
Fax: 82-2-523-1483
E-Mail: [log in to unmask]

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