Denny

IPC-TM-650 method 2.6.16 used the pressure vessel test for laminate integrity, thou I assume the conditions would be transferable.  Also the HDI committee is looking at a draft of a pressure vessel test for some of the new structures.  I took a quick look at the method and have tenatively numbered it 2.6.16.1.  Chris Jorgensen of IPC staff can provide a copy if you like.

Best Regards
Dave

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David W. Bergman
Vice President of Technical Programs
IPC
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>>> <[log in to unmask]> 09/15/97 03:11PM >>>
I am looking for companies that use pressure cooker methodologies to evaluate
oxide coatings of copper inner layer circuitry.   One of our overeas offices
recently asked if we could test this way, and I don't know what procedure to
follow.  I don't recall any IPC test for this, and wonder if it is derived
from an IEC or JEDEC oriented test.   If I understand correctly, the "cook"
is saturated humidity at 1.3 atmospheres (about 120 C) for up to two hours,
some room temperature equilabration period, and then solder float for 10
seconds.   Please reply where I can find the exact methodology.

Denny Fritz

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