The SMART Group will be running the First Public Workshop on Pin In
Hole/Intrusive Reflow on 4th November in Milton Keynes, England. Further
information may be obtained for the SMART Group Home Page
http://www.smtuk.demon.co.uk

Call Tony Gordon Tel: (44) 01494 465217
Email: [log in to unmask]

PIN IN HOLE/INTRUSIVE REFLOW DESIGN AND ASSEMBLY WORKSHOP

Surface Mount Technology (SMT) is now part of mainstream electronic
assembly with virtually all market sectors benefiting from the use of SMT.
One problem that has always proved an issue to design and process engineers
is the use of existing through hole components where no direct equivalent
SMT parts are available.

It is possible to hand solder conventional through hole components after
surface mount assembly and soldering operations are complete. This,
however, is time consuming and may leave more flux residues on the surface
of the joints causing a problem to in circuit test. Many through hole parts
are used for direct contact during test and residues can quickly clog test
pins in a no clean process.

A range of selective soldering equipment is available to either semi or
fully automatically solder through hole leads. This does, of course,
require capital expenditure on equipment. One method of soldering all
surface mount and through hole components in a single operation is
Pin-In-Hole-Reflow (PIHR) or Intrusive Reflow Soldering which simplifies
the manufacturing process.

The workshop will cover the following key points:

PCB Design and Component Requirements
Possible Assembly Stages
PIHR Advantages and Disadvantages
Paste Application by:
        Stencil Printing
        Double Stencil Print
        Paste Dispensing
Stencil Aperture Calculations
Solder Pallet Support
Reflow Soldering Profiles
Inspection Requirements
Microsection Analysis
Evaluation Results
Process Defects

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For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
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