TECHNET Archives

September 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
BGA Singulation Technologies Question
From:
Udi Efrat <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Thu, 11 Sep 1997 10:28:14 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines) 
For my general information, could somebody give a primer on methods and
equipment in use today, for singulating PBGA packages in matrix strip
form?
I know there are "die and punch" type machines that are suitable for
perforated strips, where the devices are molded individually. But what
do you use for solid BT panels, or where you have arrays molded
together?

Udi Efrat

##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TECHNET <your full name>
To unsubscribe:   SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
##############################################################

ATOM RSS1 RSS2